1005-2763
article
三贵口铅锌矿中深孔爆破参数优化研究与应用
Optimisation and Application of Medium and Deep Hole Blasting Parameters at Sanguikou Lead-zinc Mine
为了解决三贵口铅锌矿采用分段凿岩阶段空场嗣后充填法对矿块进行回采时出现的大块率较高、二步采时两侧充填体及顶柱破坏严重、矿石贫化率较大等问题，对原有爆破参数进行了优化研究，改用直径为76mm的炮孔，通过理论计算得到排距为1.8m，孔底距为2.1m；或者排距为1.9m，孔底距为2.0m。现场工业试验采场相对使用原爆破参数的采场，其贫化率降低了19.8%，损失率降低了4.6%，炸药单耗降低了12.2%，大块率降低了34.8%；同时结合LS-DYNA有限元软件对优化前后爆破效果的模拟结果表明：采用优化后的爆破参数进行爆破时，大块率较小，对两侧的充填体、顶柱及凿岩巷道眉线的损伤较小。
In order to solve the problems of high block rate, serious damage to the filling body and roof column on both sides during two-step mining, and large ore depletion rate, etc., which appeared when the ore block was mined back in the Sanguikou lead-zinc mine by the filling method after the rock drilling stage, the optimization of the blasting parameters was carried out, and the blasting holes with diameter of 76mm were used instead, and the theoretical calculations showed that the distance between the rows of holes was 1.8m, and the distance between the bottoms of the holes was 2.1m; or the distance between the rows of holes was 1.9m, and the distance between the bottoms of the holes was 2.0m. Compared with the original blasting parameters, the depletion rate of the on-site industrial test quarry was reduced by 19.8%, the loss rate was reduced by 4.6%, the unit consumption of explosives was reduced by 12.2%, and the block rate was reduced by 34.8%; at the same time, combined with the simulation results of the blasting effect before and after the optimization by LS-DYNA finite element software, the results show that: when using the optimized blasting parameters for blasting, the chunk rate is smaller, and the blasting effect on both sides of the hole is more effective than the original one. The block rate is smaller, and the damage to the filling body on both sides, the top pillar and the brow line of the rock-cutting roadway is smaller.
大块率；中深孔；爆破参数；LS-DYNA；充填体
Block rate, Medium depth hole, Blasting parameters, LS-DYNA, Filling body
冯庆杰
FENG Qingjie
紫金（长沙）工程技术有限公司
Zijin (Changsha) Engineering Technology Co., Ltd.
kyyjykf/article/abstract/k20240523005